Thermal management Printed Circuit Board (PCB) -SinkPAD TM
Layer: 1 Layer
Abu: Aluminum tushe
Ƙarfafawar thermal: 210.0w/mk
Girman allo: 2.0mm
Kaurin jan karfe: 2.o oz
Maganin saman: LF HASL
Solder mask: Black
Silk allon: Fari
Asalin: China
Rabewar Thermoelectric:SinkPADFasaha
Aikace-aikace: Kayan aikin likita
SinkPADTMfasahar tana da girma mafi girman ingancin zafi fiye da mafi kyawun MCPCB a kasuwa.SinkPADTMMCPCB yana samuwa tare da Aluminum tushe karfe ko Copper tushe karfe.Aluminum tushen SinkPADTMPCB na iya canja wurin zafi a ƙimar 210.0 W/mK da SinkPAD na tushen CopperTMPCB na iya canja wurin zafi a cikin adadin 385.0 W/mK yayin da na al'ada MCPCBs suna da ƙimar canja wurin zafi na 1-5 W/mK Hanyar da za mu iya cim ma wannan ci gaba mai ban mamaki shine ta hanyar ƙirƙirar Hanyar thermal kai tsaye daga LED zuwa tushe. karfe.