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Thermal management Printed Circuit Board (PCB) -SinkPAD TM
SinkPAD dafasaha na sarrafa thermal Printed Circuit Board (PCB).wanda ke ba da damar gudanar da zafi daga LED kuma cikin yanayi cikin sauri da inganci fiye da MCPCB na al'ada.SinkPAD yana ba da ingantaccen aikin zafi don matsakaici zuwa manyan LEDs.
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Ƙarƙashin Aluminum core laminated na jan karfe SinkPAD PCB
Menene Thermoelectric Separation Substrate?Yaduddukan kewayawa da kushin thermal akan substrate sun rabu, kuma tushen thermal na abubuwan thermal kai tsaye suna tuntuɓar matsakaicin zafin zafi don cimma mafi kyawun tasirin thermal conductive (zero thermal resistance).Abubuwan da ke cikin ƙasa gabaɗaya ƙarfe ne (Copper) substrate. -
Hanyar thermal kai tsaye MCPCB da Sink-pad MCPCB, Copper Core PCB, Copper PCB
Cikakkun Bayanan Samfura Tushen Material: Alu/ Tagulla Kauri: 0.5/1/2/3/4 OZ Kauri: 0.6-5mm Min.Ramin Diamita: T/2mm Min.Nisa Layi:0.15mm Min.Layin layi: 0.15mm farfajiya gama: HASL, Zinariya Zinare, MCPCB LED PCB buga PCB V-Yaren Kwaleji: 30 °, 45 °, 60 ° haƙuri: +/- 0.1mm Hole DIA haƙuri: +/- 0.1mm Haƙuri na thermal: 0.8-3 W / MK E-gwajin ƙarfin lantarki: 50-250V Ƙarfin kashewa: 2.2N / mm Warp ko karkatarwa:
