Iyawa

Iyawar FR4:

Abu Ƙididdiga na Fasaha
Nau'in Abu FR-1, FR-4, CEM-1, CEM-3, Rogers, ISOLA
Kauri na Abu 0.062”, 0.080”, 0.093”, 0.125”, 0.220”, 0.047”, 0.031”, 0.020”, 0.005”
Ƙididdigar Layer 1 zuwa 20 Layers
Max.Girman allo 22.00" x 28.00"
Babban darajar IPC Darasi na II, Darasi na III
Zobe na shekara 5 mil/gefe ko Mafi Girma (Min. Zane)
Gama Plating Solder(HASL), Lead Free Solder(L/F HASL), ENIG (Electroless Nickel Immersion Gold), OSP, Azurfa Immersion, Tin Immersion, Nickel Immersion, Hard Gold, da dai sauransu.
Nauyin Copper Na waje: Har zuwa 7oz, Na ciki: har zuwa 4 oz.
Raba/Nisa Sarari 3/3 mil
Girman kushin mafi ƙanƙanta mil 12
Plated Ramummuka 0.016"
Mafi Karami Rami 8 mil;4 mil
Yatsun Zinariya 1 zuwa 4 Edge (30 zuwa 50 Micron Gold)
Farashin SMD 0.080" - 0.020" - 0.010"
Nau'in Soldermask LPI Glossy, LPI-Matte
Soldermask Launi Kore, Ja, Blue, Baƙar fata, Fari, Yellow, bayyananne
Launin Almara Farar, Yellow, Black, Red, Blue.
Mafi ƙarancin Nisa Hanyar 0.031"
Bugawa (v-cut) Layi Madaidaici, Tsalle Maki, CNC V-CUT.
Zinariya HARD, SOFT, IMMERSION (har zuwa 50 MICRON GOLD)
Tsarin Fayil na Bayanai Gerber RS-274x tare da buɗe ido.
Fab.Tsarin Zane Fayilolin Gerber, DXF, DWG, PDF
Halayen Rabo 10:01
Counter Sink / Counter Bore Ee
Sarrafa Ƙarfafawa Ee
Vias Makafi / Binne Vias Ee
Maski mai kwasfa Ee
Carbon Ee

MC PCB iyawar:

Abu Ƙididdiga na Fasaha
Adadin yadudduka Gefe ɗaya, Gefen Biyu, Layi huɗu MCPCB
Nau'in samfur Aluminum, Copper, Iron tushe MCPCB
Mai ba da laminate Berquist, Ventec, Polytronics, Boyu, Wazam da dai sauransu.
Ƙarshe allon kauri 0.2 ~ 5.0mm
Kaurin jan karfe zafi - 3 oz
Mai ba da abin rufe fuska na solder Taiyo, Fotochem da dai sauransu.
Launi na solder mask Fari, Black, Ja, Blue, Yellow da dai sauransu.
Ƙarshen saman L/F HASL, OSP, ENIG, Electrolytic Silver, Immersion Tin, Immersion Azurfa da dai sauransu.
Nau'in gama-gari Rarraba, Punching, V-yanke
Ruku'u da karkatarwa ≤0.75%
Girman min rami 1.0mm
Max.girman allo 1500mmX610mm
Min.girman allo 10mmX10mm