Low-cost Aluminum core laminated copper foil SinkPAD PCB Featured Image

Ƙarƙashin Aluminum core laminated na jan karfe SinkPAD PCB

Menene Thermoelectric Separation Substrate?

Yaduddukan kewayawa da kushin thermal akan substrate sun rabu, kuma tushen thermal na abubuwan thermal kai tsaye suna tuntuɓar matsakaicin zafin zafi don cimma mafi kyawun tasirin thermal conductive (zero thermal resistance).Abubuwan da ke cikin ƙasa gabaɗaya ƙarfe ne (Copper) substrate.

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Cikakken Bayani

PCB bayanai

Nau'in PCB	SinkPAD II Technology
Girman PCB	50.0×60.0mm
Siffar	Allolin da'ira
Tushen Karfe Nau'in	Aluminum
Kammala Kauri	0.062 inci (1.57 mm)
Hanyar Zazzabi Kai tsaye	EE
Thermal Conductivity	240.0 W/mK
Ƙarshen Sama	LF HASL
Gwajin Canjin Gilashi.	170 digiri Celsius
UL Amincewa	Ee
Amincewa da RoHS	Ee