EMC Design Spark FR4 PCB Da Bugawar Wutar Wuta


Cikakken Bayani

Cikakken Bayani

Tushe Material: FR4

Kauri na Copper: 1 oz

Girman allo: 1.6mm

Min.Girman Ramin: 0.2mm

Min.Layin Nisa: 0.1mm

Min.Tazarar layi: 0.1mm

Kammala saman:HASL

Solder Mask: Green

Silkscreen: Fari

Gwajin PCB:Test-rig, Gwajin Binciken Flying

Gwajin PCBA: X-ray, Gwajin AOI, Gwajin Aiki

Takaddun shaida: UL.ROHS.CE

Nau'in sabis: Babban Ingancin PCB Manufacturing

Mahimman kalmomi: Farashin allon PCB mara kyau

Sabis: Sabis na Tasha Daya

Layer: 1-24

Abu

Ƙayyadaddun bayanai

 

1

Yawan Layer

1-18 Layi

2

Kayan abu

FR-4,FR2.Ta-conic,Rogers, CEM-1 CEM-3, yumbu, crockery Metal goyon Laminate
3

Ƙarshen Sama

HASL(LF), Zinare plating, Electrolysis nickel immersion zinariya, Immersion Tin, OSP

4

Kauri na Ƙarshe

0.2mm-6.00mm(8mil-126mil)

5

Kaurin Copper

1/2 oz min; 12 oz max

6

Solder Mask

Kore/Baki/Fara/Ja/Blue/Yellow

7

Min.Trace Nisa & Tazarar Layi

0.075mm/0.1mm(3mil/4mil)

8

Diamita Min.Rami don hakowa na CNC

0.1mm(4mil)

9

Diamita Min. Hole don naushi

0.9mm(35mil)

10

Girman panel mafi girma

610mm*508mm

11

Matsayin rami

+/- 0.075mm (3mil) CNC hakowa

12

Nisa Mai Gudanarwa(W)

0.05mm (mil 2) ko;+/- 20% na ainihin zane-zane

13

Diamita (H)

PTH L: +/-0.075mm(3mil);BA-PTH L:+/-0.05mm(2mil)

14

Haƙuri na Shaci

0.125mm (5mil) Hanyar CNC;+/- 0.15mm(6mil) ta Punching

15

Warp & Twist

0.70%

16

Juriya na Insulation

10 Kohm-20Mohm

17

Gudanarwa

<50ohm

18

Gwajin Wutar Lantarki

10-300V

19

Girman panel

110×100mm(min);660×600mm(max)

20

Hidimar Layer-Layer

4 yadudduka: 0.15mm (6mil) max;6 yadudduka: 0.25mm (10mil) max

21

Min. tazarar tsakanin ramin ramin zuwa ƙirar zagaye na ciki

0.25mm (mil 10)

22

Min. tazarar tsakanin allon nunin tsarin kewayawa na Layer na ciki

0.25mm (mil 10)

23

Hakuri kauri na allo

4 yadudduka: +/- 0.13mm (5mil);6 yadudduka:+/-0.15mm(6mil)

24

Sarrafa Impedance

+/- 10%

25

Daban-daban Impedance

+-/10%
5
6

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