EMC Design Spark FR4 PCB Da Bugawar Wutar Wuta
Cikakken Bayani
Tushe Material: FR4
Kauri na Copper: 1 oz
Girman allo: 1.6mm
Min.Girman Ramin: 0.2mm
Min.Layin Nisa: 0.1mm
Min.Tazarar layi: 0.1mm
Kammala saman:HASL
Solder Mask: Green
Silkscreen: Fari
Gwajin PCB:Test-rig, Gwajin Binciken Flying
Gwajin PCBA: X-ray, Gwajin AOI, Gwajin Aiki
Takaddun shaida: UL.ROHS.CE
Nau'in sabis: Babban Ingancin PCB Manufacturing
Mahimman kalmomi: Farashin allon PCB mara kyau
Sabis: Sabis na Tasha Daya
Layer: 1-24
Abu | Ƙayyadaddun bayanai | |
1 | Yawan Layer | 1-18 Layi |
2 | Kayan abu | FR-4,FR2.Ta-conic,Rogers, CEM-1 CEM-3, yumbu, crockery Metal goyon Laminate |
3 | Ƙarshen Sama | HASL(LF), Zinare plating, Electrolysis nickel immersion zinariya, Immersion Tin, OSP |
4 | Kauri na Ƙarshe | 0.2mm-6.00mm(8mil-126mil) |
5 | Kaurin Copper | 1/2 oz min; 12 oz max |
6 | Solder Mask | Kore/Baki/Fara/Ja/Blue/Yellow |
7 | Min.Trace Nisa & Tazarar Layi | 0.075mm/0.1mm(3mil/4mil) |
8 | Diamita Min.Rami don hakowa na CNC | 0.1mm(4mil) |
9 | Diamita Min. Hole don naushi | 0.9mm(35mil) |
10 | Girman panel mafi girma | 610mm*508mm |
11 | Matsayin rami | +/- 0.075mm (3mil) CNC hakowa |
12 | Nisa Mai Gudanarwa(W) | 0.05mm (mil 2) ko;+/- 20% na ainihin zane-zane |
13 | Diamita (H) | PTH L: +/-0.075mm(3mil);BA-PTH L:+/-0.05mm(2mil) |
14 | Haƙuri na Shaci | 0.125mm (5mil) Hanyar CNC;+/- 0.15mm(6mil) ta Punching |
15 | Warp & Twist | 0.70% |
16 | Juriya na Insulation | 10 Kohm-20Mohm |
17 | Gudanarwa | <50ohm |
18 | Gwajin Wutar Lantarki | 10-300V |
19 | Girman panel | 110×100mm(min);660×600mm(max) |
20 | Hidimar Layer-Layer | 4 yadudduka: 0.15mm (6mil) max;6 yadudduka: 0.25mm (10mil) max |
21 | Min. tazarar tsakanin ramin ramin zuwa ƙirar zagaye na ciki | 0.25mm (mil 10) |
22 | Min. tazarar tsakanin allon nunin tsarin kewayawa na Layer na ciki | 0.25mm (mil 10) |
23 | Hakuri kauri na allo | 4 yadudduka: +/- 0.13mm (5mil);6 yadudduka:+/-0.15mm(6mil) |
24 | Sarrafa Impedance | +/- 10% |
25 | Daban-daban Impedance | +-/10% |