Shenzhen saman ingancin aluminum PCB MCPCB tare da Taiyo PSR-4000 jerin farin solder mask
Ƙarfin Ƙarfafawa:
abu | Ƙarfin Ƙarfafawa |
Kayan abu | FR4, CEM-1, Aluminium, Poly amide |
Layer No. | 1-12 |
Kaurin allo da aka gama | 0.1mm-4.0mm |
Hakuri da kauri na allo | ± 10% |
Cooper kauri | 0.5 OZ-3OZ (18 um-385 um) |
Ramin Rufe Copper | 18-40 ku |
Sarrafa Impedance | ± 10% |
Warp&Twist | 0.70% |
Kwasfa iya | 0.012" (0.3mm) -0.02'(0.5mm) |
Hotuna
Min Trace Nisa (a) | 0.075mm (mil 3) |
Min Space Nisa (b) | 0.1mm (4 mil) |
Min Annular Ring | 0.1mm (4 mil) |
SMD Pitch (a) | 0.2 mm (mil 8) |
BGA Pitch (b) | 0.2 mm (mil 8) |
Solder Mask
Min Solder Mask Dam (a) | 0.0635 mm (mil 2.5) |
Tsabtace abin rufe fuska (b) | 0.1mm (4 mil) |
Min SMT Pad tazarar (c) | 0.1mm (4 mil) |
Solder Mask | 0.0007" (0.018mm) |
Ramuka
Girman Hole Min (CNC) | 0.2 mm (mil 8) |
Girman Ramin Min Punch | 0.9 mm (35 mil) |
Girman Ramin TOL (+/-) | PTH: ± 0.075mm; NPTH: ± 0.05mm |
Matsayin Ramin TOL | ± 0.075mm |
Plating
HASL | 2.5m ku |
Jagorar HASL kyauta | 2.5m ku |
Immersion Zinariya | Nickel 3-7um Au: 1-5u '' |
OSP | 0.2-0.5m |
Shaci
Faɗakarwar Tashar TOL (+/-) | CNC: ± 0.125mm, Punching: ± 0.15mm |
Beveling | 30°45° |
Wurin yatsa na Zinariya | 15° 30° 45° 60° |
Takaddun shaida | ROHS, ISO9001: 2008, SGS, UL takardar shaidar |
Za mu iya yi muku:
1-12 Layer FR4 PCB.
1-2 Layer aluminum PCB.
1-4Layer m PCB.
Saukewa: CEM-1 PCB
Saukewa: PCB
SMT da sabis na taro na DIP.
Ku rubuta sakonku anan ku aiko mana