Hanyar thermal kai tsaye MCPCB da Sink-pad MCPCB, Copper Core PCB, Copper PCB
Cikakken Bayani
Base Material: Alu/ jan karfe
Kaurin Copper:0.5/1/2/3/4 OZ
Kauri na allo: 0.6-5mm
Min.Ramin Diamita: T/2mm
Min.Layin Nisa: 0.15mm
Min.Tazarar layi: 0.15mm
Kammala saman:HASL, Zinare nutsewa, Zinare mai walƙiya, azurfa mai laushi, OSP
Abu sunan: MPCCB LED PCB Printed allon kewayawa, Aluminum PCB, Copper core
PCB
V-yanke kusurwa:30°,45°,60°
Haƙurin siffar:+/- 0.1mm
Haƙurin ramin DIA:+/- 0.1mm
Ƙarfin Ƙarfafawa: 0.8-3 W/MK
E-gwajin ƙarfin lantarki: 50-250V
Ƙarfin cirewa: 2.2N/mm
Juya ko karkatarwa:
PTH bango kauri:>0.025mm
| A'a. | Abubuwa | Fihirisa |
| 1 | Maganin Sama | HASL, Zinare nutsewa, Zinare mai walƙiya, Azurfa mai laushi, OSP |
| 2 | Layer | Gefe guda ɗaya |
| 3 | PCB Kauri | 0.6-5 mm |
| 4 | Ciwon Takardun Tagulla | 0.5-4 oz |
| 5 | Min rami diamita | T/2mm |
| 6 | Nisa Min Layi | 0.15mm |
| 7 | Yadudduka | 1-4 yadudduka |
| 8 | Matsakaicin girman allo | 585mm*1185mm |
| 9 | Girman allo Min | 3mm*10mm |
| 10 | Kaurin allo | 0.4-6.0mm |
| 11 | Min sarari | 0.127 mm |
| 12 | PTH kaurin bango | 0.025mm |
| 13 | V-yanke | 30/45/60 digiri |
| 14 | Girman yankan V | 5mm*1200mm |
| 15 | Min. jakar kushin | 0.35mm |
Bayar: MCPCB mai gefe guda, MCPCB mai gefe biyu, MCPCB mai lankwasa, MCPCB mai lanƙwasa, MCPCB musayar zafi kai tsaye, eutectic bonding flip -chip MCPCB.An keɓance MCPCB ɗin mu.
1.aluminum tushe PCB LED haske ya jagoranci hasken haske ya jagoranci
2.aluminum substrate PCB
3.aluminum tushe laminate PCB
4.aluminum tushe PCB
1) abu: FR-4, Copper, Aluminum tushen
2) Layer: 1-4
3) kauri na jan karfe: 0.5oz, 1.0oz, 2oz, 3oz, 4oz
4) Ƙarshen saman: HASL, OSP, Zinare na Zinare, Azurfa na nutsewa, Zinariya ta Filashi, Azurfa mai Plated.
5) solder mask launi: Green, baki, fari.
6) V-yanke kwana: 30, 45,60 digiri
7) E-gwajin ƙarfin lantarki: 50-250V
8) Takaddun shaida: UL, ISO9001, ROHS, SGS, CE
Ƙarfin Fasaha na MC PCB
| ;Nau'in | Abu | Iyawa | Nau'in | Abu | Iyawa |
| Yadudduka | / | 1-4 | Girman rami | Girman rami mai hakowa | 0.6-6.0mm |
| Laminate | Laminate irin | Aluminum, ƙarfe, da kuma tushen keɓewar tagulla | Haƙuri ramuka | ± 0.05mm | |
| Girma | 1000*1200mm 60081500mm | Haƙuri na matsayi na rami | ± 0.1mm | ||
| Kaurin allo | 0.4mm-3.0mm | Halin yanayin | 5:1 | ||
| Haƙuri da kauri na allo | ± 0.1mm | Solder mask | Min solder gada | 4 mil | |
| Dielectric kauri | 0.075-0.15mm | Impedance | Hakuri na rashin ƙarfi | ± 10% | |
| kewaye | Min nisa/ sarari | 5mil/ 5m | Ƙarfin kwasfa | ≥1.8 N/mm | |
| Haƙuri na faɗin/ sarari | ± 15% | Juriya na saman | ≥1*105M | ||
| Kaurin jan karfe | Ciki da waje | 0.5-10 OZ | ≥1*106M | ||
| Adadin juriya | |||||
| Ƙarfafawar thermal | Ƙunƙarar ƙarancin zafi 1.0-1.5 | ||||
| Ƙunƙarar zafi na tsakiya 1.5-1.8 | |||||
| Babban ƙarfin aiki 2.0-8.0 | |||||
| Solder fioat | 260 ℃, 10mil, Babu blister, Babu ƙaddara | ||||
| Izini | ≤4.4 | ||||
